xMEMS has developed what they describe as an ‘active micro cooling fan on a chip.’ The XMC-2400 is a 1mm-thick, self-contained active cooling system designed to replace passive cooling systems on chipsets. The chip works by oscillating a thin layer of film at ultrasonic frequencies to build air pressure, then releasing the air pressure rapidly to create airflow. It’s an inventive little device that xMEMS is positioning for smartphones and wearables, but the principles involved could theoretically be applied to any range of electronics. The XMC-2400 measures 9.3 x 7.6 x 1.13 mm, a diminiutive size that could see this type of active cooling fit pretty much anywhere. The company says it will begin manufacturing its fan-on-chip in early 2026.
