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Vanguard Chromium Fine Pixel Series LED Display

Vanguard announces its Chromium Fine Pixel Series. Direct Chip to PCB (DCP) technology solders three (3) LED chips, 1 red, 1 blue, 1 green, directly onto a PCB board. The SMD process inserts the three (3) chips into a bulb/lamp which lamps are then affixed to a PCB Board. The Direct Chip to PCB (DCP) manufacturing process results in a perfectly flat, uniform LED surface allowing for a flawless encapsulation of the chips using a clear epoxy resin. The encapsulation of SMD bulbs cannot result in a perfectly flat surface.

Direct Chip to PCB (DCP) technology is a two (2) step manufacturing process as opposed to the four (4) step SMD process. THE COB manufacturing process eliminates the need for a bracket and supports, thereby reducing the number of soldering steps and, as a result, the number of possible failure points (as illustrated in diagram). Direct Chip to PCB (DCP) technology is up to ten (10) times more reliable than SMD. 10/ppm vs. 50- 100/ppm.

The encapsulation of the LED chips using clear epoxy resin creates a protective surface that is highly impact resistant. Direct Chip to PCB (DCP) technology is a safeguard against the intrusion of humidity, and is also anti-static, anti-dust, and waterproof on the front of the display. Direct Chip to PCB (DCP) technology also provides for a higher contrast ratio, sharpness and deeper colors than SMD/GOB.

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